904-27-1-12-2-B-0

Name: Wakefield Thermal 904-27-1-12-2-B-0
Brand: Wakefield Thermal
SKU: 567-904-27-1-12-2-B
Price: 8.54 EUR
Availability: InStock

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Mouser No:

567-904-27-1-12-2-B

Mfr. No:

904-27-1-12-2-B-0

Mfr.:

Wakefield Thermal

Description:

Heat Sinks Chipset Heat Sink with Clip, Elliptical, 27mm Chip Size, 11.6mm Height, Aluminum

Datasheet:

904-27-1-12-2-B-0 Datasheet (PDF)

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In Stock: 212

Stock:: 212 Can Dispatch Immediately

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Factory Lead Time:: 16 Weeks Estimated factory production time for quantities greater than shown.

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	8,54 €	8,54 €
	8,10 €	81,00 €
	7,65 €	191,25 €
	7,19 €	359,50 €
	6,75 €	675,00 €
	6,35 €	1.905,00 €
	6,12 €	3.672,00 €
	5,90 €	7.080,00 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Wakefield Thermal
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sink Assemblies
Designed for:	Component, 27mm
Mounting Style:	Clip
Heatsink Material:	Aluminum
Fin Style:	Pin Fin
Length:	27 mm
Width:	27 mm
Height:	11.6 mm
Brand:	Wakefield Thermal
Color:	Black
Product Type:	Heat Sinks
Series:	900
Factory Pack Quantity:	300
Subcategory:	Heat Sinks
Type:	Component
Unit Weight:	10 g

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Datasheet

904-27-1-12-2-B-0 Datasheet (PDF)

Images

RoHS Certificate (PDF)

CNHTS:: 8548000090
USHTS:: 8473302000
ECCN:: EAR99

900 Series Elliptical Fin Heat Sinks

Wakefield Thermal 900 Series Elliptical Fin Heat Sinks are designed for airflow applications, including telecom, data centers, networking, cloud computing, and other industries. The heat sinks are constructed of AL 6063 material with a black anodized finish. Wakefield Thermal 900 Series Elliptical Fin Heat Sinks are RoHS compliant and compatible with devices from a wide range of suppliers, including Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD, Nvidia, Vishay, Powerex, Infineon, Microsemi, and more.