MicroSpeed Triple High-Speed Connectors

TE Connectivity's ERNI MicroSpeed Triple High-Speed Connectors are ideally suited for next-generation communication standards such as Next Generation Ethernet 100Gbit/s (IEEE 802.3ba), optical internetworking forum (OIF), and the Internet of Things (loT). These shielded, high-density connectors utilize three rows to enable data rates of up to 25Gbit/s. They have SMT terminals that provide a high contact density with 3 x 25 positions in a 1mm pitch. Applications for TE Connectivity's ERNI MicroSpeed Triple High-Speed Connectors include data communication and telecommunication, high-end computing, medical technology, and industrial automation.

Results: 2
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Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Product
Number of Positions
Pitch
Number of Rows
Termination Style
Mounting Angle
Stack Height
Current Rating
Contact Plating
Series
Packaging
TE Connectivity / ERNI Board to Board & Mezzanine Connectors MSPEED 75 M SMD M1 BE ABC VVV 137 176 *
Datasheet
Product Comments
Non-Stocked Lead-Time 15 Weeks
Min.: 450
Mult.: 450
Reel: 450

Connectors 75 Position 1 mm (0.039 in) 3 Row Solder Vertical 1 mm 1 A Gold MicroSpeed Reel
TE Connectivity / ERNI Board to Board & Mezzanine Connectors MSPEED 75 F SMD F4 BE ABC VVV 137 176 *
Datasheet
Product Comments
Non-Stocked Lead-Time 15 Weeks
Min.: 550
Mult.: 550
Reel: 550

Connectors 75 Position 1 mm (0.039 in) 3 Row Solder Vertical 4 mm 1 A Gold MicroSpeed Reel