ADLINK Technology Embedded Solutions

Memory Modules DDR5-5600, 32GB, 2Gx8, SO-DIMM 262P, 1.1V, Rank:2, CL46, non-ECC, OP Temp:-40-95, Fix Die:Yes(P-die), Samsung Chip(2Gx8)

Memory Modules DDR5-5600, 32GB, 4Gx72, SO-DIMM 262P, 1.1V, CL46, Rank:2, ECC, OP Temp:-40-95, Fix Die: Yes(A-die), Hynix Chip(2048Mx8), height 30 mm

Memory Modules DDR5-5600, 8GB, 1Gx16, SO-DIMM 262P, 1.1V, Rank:1, CL46, non-ECC, OP Temp:-40-95, Fix Die:Yes(P-die), Samsung Chip(1Gx16)

Industrial Box PCs DEX-100 system Data extraction system

Industrial Computing Accessories DLAP-211 DIN RAIL setREV:A ME Parts

Interface Modules DLAP-211-JNX w. Jetson Xavier NX module, 1xHDMI, 4x USB 3.0 + 1x OTG, 2x GbE, 1x Audio, 1x RS-232, 1x SD slot, 1x mini PCIe slot, 1x M.2 2242/3042 slot, 1x CANBUS, 12Vdc input

Interface Modules DLAP-211-JNXSw. Jetson Xavier NX module, 1xHDMI, 4x USB 3.0 + 1x OTG, 2x GbE, 1x Audio, 1x RS-232, 1x SD slot, 1x mini PCIe slot, 1x M.2 2242/3042 slot, 1x CANBUS, UART/I2C/SPI/GPIO, 12Vdc input

Embedded Box Computers DLAP-211-Nano w. Jetson Nano module, 1xHDMI, 4x USB 3.0 + 1x OTG, 2x GbE, 1x RS-232, 1x SD slot, 1x mini PCIe slot, 1x M.2 2242/3042 slot, 12Vdc input

Industrial Computing Accessories DLAP-2XX SERIES DIN RAIL setREV:A ME Parts

Industrial Box PCs i7-9700E, Q370, MXM RTX3000, 2x16GB DDR4 SODIMM, 6xDP, 6xGbE, 2xCOM, 6xUSB3, 2xUSB2, M.2 E/B/M key, TPM, Audio(AMP), DIO

Rack Mount / Server PCs w. Jetson AGX Orin module, 1xHDMI, 4x USB 3.2 Gen2 + 1x OTG, 4x GbE w/o PSE, 1x Audio, 1x COM, 1x MicroSD slot, 1x M.2 M key slot, 1x M.2 B key slot,, 1x M.2 E key slot 1x CANBUS,(32 x GPIO/ 2x UART,2 x I2C, 1 x SPI, 19 x GPIO) 24Vdc input

Industrial Box PCs i5-12500E, R680E, 3xDP, 2x HDMI, 6x 2.5GbE, 2xCOM, 4xUSB3Gen2, 2xUSB3Gen1, USB2 dongle, 2xUSIM, TPM2.0, M.2(A,B,M), 2x2.5" SATA, 2x DDR5 8GB, MXM-A2000