Data Centre Applications

Bergquist Company Data Center Applications feature advanced materials that help with thermal management, long-term reliability, and stress protection. Data center speeds and volumes are growing as analytics, artificial intelligence (AI), and high-performance computing go mainstream. This increased demand is causing next-generation data centers to run hotter, and this heat can degrade performance. Bergquist Company designs and manufactures component-level thermal management and stress protection products, which help meet these heightened performance requirements.

Results: 211
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Product Type Package/Case Material Thermal Conductivity Breakdown Voltage Color Minimum Operating Temperature Maximum Operating Temperature Length Width Thickness Tensile Strength Flammability Rating Series Packaging
Bergquist Company 2590952
Bergquist Company Thermal Interface Products Gap Filler (2-Part), No Spacer Beads, Pot Life = 60m, 3.6 W/m-K Drop Dispatch Lead Time 3 Weeks
Min.: 4
Mult.: 1

3500S35 / TGF 3600
Bergquist Company 2605454
Bergquist Company Thermal Interface Products Gap Filler, Thermally Conductive, Liquid Gap Filler, Dual Cartridge Drop Dispatch Lead Time 3 Weeks
Min.: 2
Mult.: 1

3500LV / TGF 3500LVO
Bergquist Company 2605486
Bergquist Company Thermal Interface Products Thermally Conductive, Liquid Gap Filler, Gap Filler TGF 3500LVO / 3500LV Drop Dispatch Lead Time 3 Weeks
Min.: 3
Mult.: 1

3500LV / TGF 3500LVO
Bergquist Company 2641227
Bergquist Company Thermal Interface Products Gap Filler, Thermally Conductive, Liquid Gap Filler, Dual Cartridge Drop Dispatch Lead Time 3 Weeks
Min.: 2
Mult.: 1

3500LV / TGF 3500LVO
Bergquist Company 2641230
Bergquist Company Thermal Interface Products Thermally Conductive, Liquid Gap Filler, Gap Filler TGF 3500LVO / 3500LV Drop Dispatch Lead Time 3 Weeks
Min.: 1.085
Mult.: 1

3500LV / TGF 3500LVO
Bergquist Company 2641232
Bergquist Company Thermal Interface Products Thermally Conductive, Liquid Gap Filler, Gap Filler TGF 3500LVO / 3500LV Drop Dispatch Lead Time 3 Weeks
Min.: 1.085
Mult.: 1

3500LV / TGF 3500LVO
Bergquist Company 2746202
Bergquist Company Thermal Interface Products Gap Filler, Thermally Conductive, Liquid Gap Filler, Dual Cartridge Drop Dispatch Lead Time 6 Weeks
Min.: 13
Mult.: 1

4000 / TGF 4000
Bergquist Company 2796659
Bergquist Company Thermal Interface Products Conductive Gel Interface for Data/Telecom, 10 W/m-K, 1 Gallon Pail, Liqui-Form Drop Dispatch Lead Time 3 Weeks
Min.: 25
Mult.: 1

TLF 10000
Bergquist Company Thermal Interface Products Phase Change Material, Thin Bond, 8.5 W/m-K, 800W, 0.008" Thick, 11"x75' Roll

Phase Change Materials Phase Change Material Non-standard 5.3 W/m-K - 40 C + 150 C 0.203 mm UL 94 V-0 THF 5000UT
Bergquist Company Thermal Interface Products Phase Change Material, Thin Bond, 8.5 W/m-K, 800W, 0.010" Thick, 11"x75' Roll

Phase Change Materials Phase Change Material Non-standard 5.3 W/m-K - 40 C + 150 C 0.254 mm UL 94 V-0 THF 5000UT
Bergquist Company Thermal Interface Products Phase Change Material, Thin Bond, 8.5 W/m-K, 800W, 0.012" Thick, 11"x75' Roll

Phase Change Materials Phase Change Material Non-standard 5.3 W/m-K - 40 C + 150 C 3.07 mm UL 94 V-0 THF 5000UT