Tflex™ HR6.5 Thermal Gap Filler

Laird Tflex™ HR6.5 Thermal Gap Filler is a thermal interface material with >6W/mK thermal conductivity and high recovery properties. This filler is designed to withstand cyclic gap changes caused by shock, vibration, or warpage, providing consistent thermal performance throughout the part's life. HR6.5 material provides minimal stress on components, is easily assembled, and, in many cases, can be reused after rework due to its good rebound capability. Laird Tflex HR6.5 Thermal Gap Filler offers a 1mm to 5mm thickness range, ceramic-filled silicon sheet construction, a UL 94V-0 flammability rating, and an operating temperature range of -50°C to +150°C.