+ 85 C Modules multiprotocoles

Résultats: 616
Sélectionner Image Référence Fab. Description Fiche technique Disponibilité Prix (EUR) Filtrer les résultats dans le tableau par prix unitaire basé sur votre quantité. Qté. RoHS Modèle de ECAO Série Fréquence Alimentation en sortie Type d'interface Tension d’alimentation - Min. Tension d’alimentation - Max. Température de fonctionnement min. Température de fonctionnement max. Type de connecteur d'antenne Dimensions Protocole : Bluetooth, BLE - 802.15.1 Protocole - Cellulaire, NBIoT, LTE Protocole - GPS, GLONASS Protocole - Sous-Ghz Protocole : Wi-Fi - 802.11 Protocole : ANT, Thread, Zigbee - 802.15.4 Qualification Conditionnement

Texas Instruments Modules multiprotocoles WL18xxMOD Dual-Band Ind Mod A 595-WL1837 A 595-WL1837MODGIMOCR
50026-08-26 attendu
Min. : 1
Mult. : 1
: 250

WL1837MOD 2.4 GHz, 5 GHz 17.3 dBm SDIO, UART 2.9 V 4.8 V - 40 C + 85 C RF 13.4 mm x 13.3 mm x 2 mm Bluetooth 5.1 802.11 a/b/g/n Reel, Cut Tape, MouseReel

Murata Electronics Modules multiprotocoles Type 2AE Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 5.0
4.000Sur commande
Min. : 1
Mult. : 1
: 1.000

2AE 2.4 GHz, 5 GHz 17 dBm SDIO, UART, USB 1.62 V 3.63 V - 40 C + 85 C External 8 mm x 7.8 mm x 1.15 mm Bluetooth 5.2 802.11 a/b/g/n/ac Reel, Cut Tape
Ezurio Modules multiprotocoles 60 Series, Sterling Module w/u.FL, SDIO/UART
400Sur commande
Min. : 1
Mult. : 1

60-2230C 2.4 GHz, 5 GHz 18 dBm UART, USB 2.97 V 3.63 V - 40 C + 85 C u.FL 22 mm x 30 mm x 3.3 mm Bluetooth 5.1 802.11 a/b/g/n/ac Tray
Telit Cinterion Modules multiprotocoles
18014-01-27 attendu
Min. : 1
Mult. : 1

I2C, SPI, UART 3.4 V 4.2 V - 40 C + 85 C 28.2 mm x 28.2 mm x 2.2 mm Bluetooth LTE WiFi Tray
Digi Modules multiprotocoles Digi XBee 3 Low-Power LTE-M/NB-IoT, GNSS, Telit ME310G1-W1, No SIM
85007-12-26 attendu
Min. : 1
Mult. : 1

XBee 3 I2C, SPI, UART 3.3 V 4.3 V - 40 C + 85 C u.FL 24.38 mm x 32.94 mm
Digi Modules multiprotocoles Digi XBee 3 Global LTE-M/NB-IoT, GNSS, 2G fallback, Telit ME310G1-WW, No SIM
3.30012-10-26 attendu
Min. : 1
Mult. : 1

XBee 3 I2C, SPI, UART 3.3 V 4.3 V - 40 C + 85 C u.FL 24.38 mm x 32.94 mm
Embedded Artists Modules multiprotocoles 1YN M.2 Wi-Fi 4 b/g/n, Bluetooth 5.2 with CYW43439 chipset and LBEE5KL1YN
75001-12-26 attendu
Min. : 1
Mult. : 1

2.4 GHz 4-Wire UART, SDIO 3 V 3.5 V - 30 C + 85 C u.FL 22 mm x 44 mm Bluetooth 5.2 802.11 a/b/g/n Bulk
Nordic Semiconductor Modules multiprotocoles Lower Power SIP for cellular IoT and DECT NR+ 670En stock
4.100Sur commande
Min. : 1
Mult. : 1
: 100

nRF91 23 dBm I2C, I2S, SPI, UART, USB 3 V 5.5 V - 40 C + 85 C Reel, Cut Tape
Nordic Semiconductor Modules multiprotocoles Low Power Cellular IoT SIP, LTE-M, NB-IoT, GNSS wireless modem
2.50025-12-26 attendu
Min. : 1
Mult. : 1
: 2.500

700 MHz to 2.2 GHz 23 dBm I2C, I2S, SPI, UART 3 V 5.5 V - 40 C + 85 C 16 mm x 10.5 mm x 1.04 mm DECT NR+, LTE Cat-M1/NB1/NB2 GPS, QZSS Reel, Cut Tape
CEL Modules multiprotocoles RTL8721, Dual Band, WiFi+BLE, MFH4, BULK 5En stock
Min. : 1
Mult. : 1

CMP4020 2.4 GHz, 5 GHz 18 dBm GPIO, I2C, I2S, SDIO, SPI, UART, USB 3 V 3.6 V - 40 C + 85 C Bluetooth 5.1 Bulk
CEL Modules multiprotocoles CMP4020-2 BULK 20En stock
Min. : 1
Mult. : 1

CMP4020 2.4 GHz, 5 GHz 18 dBm GPIO, I2C, I2S, SDIO, SPI, UART, USB 3 V 3.6 V - 40 C + 85 C Bluetooth 5.1 Bulk
CEL Modules multiprotocoles ZB/Thread/BT, +20dBm, 1.64Mb, Antenna BULK 3En stock
Min. : 1
Mult. : 1

2.4 GHz 20 dBm ADC, GPIO, I2C, QSPI, SPI, UART, USB 3.3 V 3.3 V - 40 C + 85 C PCB 16.7 mm x 26.3 mm Bluetooth 5.0 Thread, Zigbee Bulk
Silicon Labs Modules multiprotocoles 802.11 b/g/n dual-band (2.4/5 GHz), dual-mode Bluetooth 5 Wi-Fi Modules
1.35716-10-26 attendu
Min. : 1
Mult. : 1

2.4 GHz, 5 GHz 18 dBm SDIO, UART, USB 1.85 V 3.3 V - 40 C + 85 C External 9.8 mm x 9.1 mm x 1.6 mm Bluetooth 5.0 802.11 a/b/g/n Tray
Ezurio Modules multiprotocoles BL651 Series - Bluetooth v5 Module, Int. Antenna (Nordic nRF52810) Tape & Reel
1.99825-08-26 attendu
Min. : 1
Mult. : 1
: 1.000

BL651 2.4 GHz 4 dBm GPIO, I2C, SPI, UART 1.7 V 3.6 V - 40 C + 85 C PCB 14 mm x 10 mm x 2.1 mm Bluetooth LE Reel, Cut Tape, MouseReel
Ezurio Modules multiprotocoles Module, Sterling LWB5+, MHF4
70018-09-26 attendu
Min. : 1
Mult. : 1
: 1.000

Sterling-LWB5+ 2.4 GHz, 5 GHz UART, USB 3.3 V 3.3 V - 40 C + 85 C 12 mm x 17 mm x 2.2 mm Bluetooth 5.2, Bluetooth LE WiFi 5, 802.11 ac Reel, Cut Tape, MouseReel
Ezurio Modules multiprotocoles Sterling LWB+, MHF4, Cut Tape
20018-08-26 attendu
Min. : 1
Mult. : 1

Sterling-LWB+ 2.4 GHz 18 dBm SDIO, UART 3.2 V 4.8 V - 40 C + 85 C RF 21 mm x 15.5 mm x 4 mm Bluetooth 5.2 WiFi 4, 802.11 b/g/n Cut Tape
Ezurio Modules multiprotocoles Sterling LWB+, MHF4, Tape and Reel
1.50002-10-26 attendu
Min. : 1
Mult. : 1
: 800

Sterling-LWB+ 2.4 GHz SDIO, UART 3.3 V 3.3 V - 40 C + 85 C 21 mm x 15.5 mm x 4 mm Bluetooth 5.2 WiFi 4, 802.11 b/g/n Reel, Cut Tape
Ezurio Modules multiprotocoles Module, Veda IF912, SIP, Dual Band, No Memory, RF Trace Pin, Cut Tape
22021-09-26 attendu
Min. : 1
Mult. : 1

IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Ezurio Modules multiprotocoles Module, Veda IF912, SIP, Dual Band, 8M PSRAM, 8M Flash, RF Trace Pin, Cut Tape
25021-09-26 attendu
Min. : 1
Mult. : 1

IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Ezurio Modules multiprotocoles Module, Veda IF913, SIP, Tri Band, No Memory, RF Trace Pin, Cut Tape
25021-09-26 attendu
Min. : 1
Mult. : 1
IF913 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Kaga FEI Modules multiprotocoles WLAN module for NXP IW611. WiFi 6 1x1 dual band, BT, BLE 5.4
30017-11-26 attendu
Min. : 1
Mult. : 1

SDIO, UART 1.71 V 2.46 V - 40 C + 85 C 25 mm x 15.7 mm x 2.1 mm Bluetooth WiFi Tray
Kaga FEI Modules multiprotocoles WLAN + ARM M33 MCU module for NXP RW612. WiFi 6 1x1 dual band, BT, BLE 5.4.
30017-11-26 attendu
Min. : 1
Mult. : 1

SDIO, UART 1.71 V 2.46 V - 40 C + 85 C 25 mm x 15.7 mm x 2.1 mm Bluetooth WiFi Tray


Espressif Systems Modules multiprotocoles Espressifs AWS IoT ExpressLink Module, pre-provisioned with required certificates and the ExpressLink firmware, for out-of-the-box connectivity to AWS IoT Core.
1.298Sur commande
Min. : 1
Mult. : 1
2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 2.7 V 3.6 V - 40 C + 85 C PCB 13.2 mm x 16.6 mm x 2.4 mm Bluetooth Bulk
Insight SiP Modules multiprotocoles nRF52832 LoRa Transceiver & BLE 5 Module US
1.058Sur commande
Min. : 1
Mult. : 1
902 MHz to 928 MHz, 2.4 GHz 22 dBm SPI 1.8 V 3.6 V - 30 C + 85 C External 9.8 mm x 17.2 mm x 1.7 mm Bluetooth 5.0
u-blox Modules multiprotocoles RW612, 802.11ax+BLE+802.15.4, ant pin, open CPU, 16MB
50011-12-26 attendu
Min. : 1
Mult. : 1
: 250

2.4 GHz, 5 GHz 11 dBm 3.15 V 3.45 V - 40 C + 85 C Antenna Pin Bluetooth LE/IEEE 802.15.4 802.11 a/b/g/n/ac/ax Reel, Cut Tape, MouseReel