Waffle Passive Bauteile

Signalaufbereitung The MBAL-0250CSP2 is a GaAs passive MMIC 1:2 balun that features excellent 35 dB common mode rejection over a 2 to 50 GHz operational bandwidth.

Signalaufbereitung The MPD4-0R404CSP2 is a small footprint MMIC 0.4-4 GHz 4-Way power divider/power splitter featuring high 20 dB isolation and 3.4 dB insertion loss in our compact CSP2 chip scale package.

Signalaufbereitung The MBAL-0220CSP2 is a GaAs passive MMIC balun featuring a frequency range of 2 to 20 GHz. This balun offers low 1.9 dB insertion loss as a mode converter, excellent balance and 27 dB common mode rejection in a compact 2.5 mm CSP2 chip scale package.

Signalaufbereitung The MPDW-0670CSP2 is a small footprint MMIC 6-70 GHz 2-Way power divider/power splitter featuring high 24 dB isolation and low 1 dB insertion loss in our compact CSP2 chip scale package.

Signalaufbereitung The MPD-0422FCSP2 is a small footprint MMIC 4-22 GHz 2-Way power divider/power splitter featuring high 24 dB isolation and low 0.7 dB insertion loss in our compact CSP2 chip scale package.

Antennen Stamped Metal WiFi 6 E/7 & BT PCB

Signalaufbereitung MPD-0226SM is a MMIC 2-way Wilkinson power divider. Passive GaAs MMIC technology allows production of smaller constructions that replace larger form factor circuit board constructions. The MPD-0226SM is available as a 4 X 4 mm QFN package.

Dickfilmwiderstände - SMD CHP 0603 100PPM 1K 1% B TR

Spezial-Keramikkondensatoren 50Volts10nF 20% Single Layer Cap

Silizium-HF-Kondensatoren / Dünnfilm 50V 680pF Tol 5% Las Mkg

Kondensator aus mehreren Keramikschichten MLCC - SMD/SMT 500V 5.1pF Tol .5pF Las Mkg

Signalaufbereitung X-Band100WLimiter,QFN