2.4 GHz, 5 GHz Modules multiprotocoles

Résultats: 311
Sélectionner Image Référence Fab. Description Fiche technique Disponibilité Prix (EUR) Filtrer les résultats dans le tableau par prix unitaire basé sur votre quantité. Qté. RoHS Modèle de ECAO Série Fréquence Alimentation en sortie Type d'interface Tension d’alimentation - Min. Tension d’alimentation - Max. Température de fonctionnement min. Température de fonctionnement max. Type de connecteur d'antenne Dimensions Protocole : Bluetooth, BLE - 802.15.1 Protocole - Cellulaire, NBIoT, LTE Protocole - GPS, GLONASS Protocole : Wi-Fi - 802.11 Protocole : ANT, Thread, Zigbee - 802.15.4 Conditionnement
Ezurio Modules multiprotocoles 60 Series, Sterling Module w/u.FL, USB/UART
15008-02-27 attendu
Min. : 1
Mult. : 1

60-2230C 2.4 GHz, 5 GHz 18 dBm UART, USB 2.97 V 3.63 V - 40 C + 85 C u.FL 22 mm x 30 mm x 3.3 mm Bluetooth 5.1 802.11 a/b/g/n/ac Tray
u-blox Modules multiprotocoles Dual-band Wi-Fi 6, BLE Stand-alone module, antenna pin, Open CPU, 16MB, NXP RW610 chip
25012-10-26 attendu
Min. : 1
Mult. : 1
: 250

IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.15 V 3.45 V - 40 C + 85 C U.FL 20.9 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ac/ax 802.15.4 Reel, Cut Tape
u-blox Modules multiprotocoles Dual-band Wi-Fi 6, BLE Stand-alone module, PCB antenna, Open CPU, 16MB, NXP RW610 chip
75031-12-26 attendu
Min. : 1
Mult. : 1
: 250

IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.15 V 3.45 V - 40 C + 85 C U.FL 20.9 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ac/ax 802.15.4 Reel, Cut Tape
u-blox Modules multiprotocoles Host-based dual-band Wi-Fi 6 and Bluetooth LE module for IoT, 1 antenna pin
50031-12-26 attendu
Min. : 1
Mult. : 1
: 500

MAYA-W4 2.4 GHz, 5 GHz 15 dBm, 18 dBm SPI, UART, USB 3.13 VDC 3.46 VDC - 40 C + 85 C Pin 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
Embedded Artists Modules multiprotocoles 1XL M.2 Wi-Fi6 a/b/g/n/ac/ax MU-MIMO, Bluetooth 5.3 with 88W9098 and LBEE5ZZ1XL
310-09-26 attendu
Min. : 1
Mult. : 1

2.4 GHz, 5 GHz UART, USB 3.14 V 3.46 V - 40 C + 85 C u.FL 22 mm x 30 mm x 1.5 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax Bulk
Silicon Labs Modules multiprotocoles 802.11 b/g/n dual-band (2.4/5 GHz), dual-mode Bluetooth 5 Wi-Fi Modules
786Sur commande
Min. : 1
Mult. : 1

2.4 GHz, 5 GHz 18 dBm SDIO, UART, USB 3 V 3.63 V - 40 C + 85 C External 9.1 mm x 9.8 mm x 1.6 mm Bluetooth 5.0 Tray
Silicon Labs Modules multiprotocoles 802.11 b/g/n dual-band (2.4/5 GHz), dual-mode Bluetooth 5 Wi-Fi Modules
28021-08-26 attendu
Min. : 1
Mult. : 1

2.4 GHz, 5 GHz 18 dBm SDIO, UART, USB 3 V 3.63 V - 40 C + 85 C External 9.1 mm x 9.8 mm x 1.6 mm Bluetooth 5.0 802.11 a/b/g/n Cut Tape
u-blox Modules multiprotocoles M.2 card with MAYA-W271, single package
23Sur commande
Min. : 1
Mult. : 1

M2-MAYA-W2 2.4 GHz, 5 GHz 18 dBm, 20 dBm I2S, UART 1.8 V 3.3 V u.FL 22 mm x 30 mm x 2.8 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Tray
NXP Semiconductors Modules multiprotocoles IW610BHN/A1ZDI
2529-10-26 attendu
Min. : 1
Mult. : 1

IW610BHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Tray
NXP Semiconductors Modules multiprotocoles IW610CHN/A1ZDI
2529-10-26 attendu
Min. : 1
Mult. : 1

IW610CHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Tray
NXP Semiconductors Modules multiprotocoles IW610FHN/A1ZDI
2529-10-26 attendu
Min. : 1
Mult. : 1
: 2.700

IW610FHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape
NXP Semiconductors Modules multiprotocoles IW612HN/A1I
10029-10-26 attendu
Min. : 1
Mult. : 1
: 2.000

IW612HN 2.4 GHz, 5 GHz I2S Bluetooth 5.2 Reel, Cut Tape
Murata Electronics Modules multiprotocoles Type 2DL-921, Shielded Small Wi-Fi 11a/b/g/n/ac/ax + Bluetooth 5.3 Module
2.675Sur commande
Min. : 1
Mult. : 1
: 1.000

2DL 2.4 GHz, 5 GHz 18 dBm UART 1.71 V 3.46 V - 40 C + 85 C u.FL 8.8 mm x 7.7 mm x 1.3 mm Bluetooth 5.3 Reel, Cut Tape, MouseReel
Silex Technology Modules multiprotocoles [Sample SKU] SX-PCEAC2 is a 2.4 GHz / 5GHz dual band IEEE802.11 a/b/g/n/ac WLAN, Bluetooth 5.0 BR/EDR/LE module based and Low power PCI express interface on Qualcomm QCA6174A-5 chipset. This SKU is the M.2 1630 PCI-E card type. Ideal for low quantity
12805-03-27 attendu
Min. : 1
Mult. : 1

SX-PCEAC2 2.4 GHz, 5 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 70 C MHF4 30 mm x 16.5 mm x 2.34 mm Bluetooth 5.0 802.11 a/b/g/n/ac Bulk
Silex Technology Modules multiprotocoles Wi-Fi+BLE Mod 2 ufl connect SamPck
173Sur commande
Min. : 1
Mult. : 1

SX-SDMAC 2.4 GHz, 5 GHz Bluetooth 5.0 802.11 a/b/g/n/ac Cut Tape
Murata Electronics Modules multiprotocoles Type 1LV Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 5.0
1.00009-06-27 attendu
Min. : 1
Mult. : 1
: 1.000

1LV 2.4 GHz, 5 GHz 17 dBm SDIO, UART 1.62 V 1.98 V - 20 C + 70 C External 10 mm x 7.2 mm x 1.4 mm Bluetooth 5.0 802.11 a/b/g/n Reel, Cut Tape, MouseReel
Quectel Modules multiprotocoles Wi-Fi 6, 802.11a/ b/ g/ n/ ac/ ax, 2 2 + 2 2, 2.4/ 5 GHz dual-band, DBS, 2.4/ 5 GHz FEM, Bluetooth 5.2, 3 antennas, supports cellular module coexistence, -30 + 75 C
10020-08-26 attendu
Min. : 1
Mult. : 1
: 250

2.4 GHz, 5 GHz PCIe, PCM, UART 1.95 V 950 mV - 30 C + 75 C 25.5 mm x 22 mm x 2.25 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Reel, Cut Tape
Quectel Modules multiprotocoles Wi-Fi 6, 802.11a/ b/ g/ n/ ac/ ax, 2 2 + 2 2, 2.4/ 5 GHz dual-band, Bluetooth 5.2, DBS
10020-08-26 attendu
Min. : 1
Mult. : 1
: 500

2.4 GHz, 5 GHz 7 dBm, 17 dBm PCIe, PCM, UART 950 mV 1.95 V 19.9 mm x 18 mm x 2.1 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Reel, Cut Tape
Quectel Modules multiprotocoles Wi-Fi 6, 802.11a/ b/ g/ n/ ac/ ax, 2 2 (2T2R), 2.4/ 5 GHz dual-band, PCIe interface, 2 antennas (BT 5.2 shares 1 Wi-Fi antenna), -40 C to +85 C
10021-08-26 attendu
Min. : 1
Mult. : 1
: 1.000
2.4 GHz, 5 GHz 3.1 V 3.6 V' - 40 C + 85 C 15 mm x 13 mm x 2.2 mm Bluetooth 5.2 Wi-Fi 6 Reel, Cut Tape
Quectel Modules multiprotocoles Wi-Fi 6 (dual band 2.4/5GHz) & Bluetooth 5.4 (Bluetooth LE Audio and BLE Long Range), SDI 3.0 interface, 1x antenna, -40 C to +85 C
10014-08-26 attendu
Min. : 1
Mult. : 1
: 1.000
2.4 GHz, 5 GHz UART 3 V 4.8 V - 40 C + 85 C 12 mm x 12 mm x 1.55 mm Bluetooth 5.4 WiFi 6 Reel, Cut Tape
Quectel Modules multiprotocoles Wi-Fi 4 & Bluetooth 5.2, dual band 2.4/5GHz, 1x antenna, -20 C to +70 C, ultra-compact LCC package, USB 2.0 interface only, antenna pin interface
10014-08-26 attendu
Min. : 1
Mult. : 1
: 1.000

2.4 GHz, 5 GHz USB 3 V 3.6 V - 20 C + 70 C 13 mm x 12.2 mm x 2 mm Bluetooth 5.2 Wi-Fi 4 Reel, Cut Tape
Quectel Modules multiprotocoles Wi-Fi 6 & Bluetooth 5.2, dual band 2.4/5GHz, 1x antenna, -20 C to +70 C, compact LCC package, USB 2.0 interface only, antenna pin interface
10001-02-27 attendu
Min. : 1
Mult. : 1
: 1.000
2.4 GHz, 5 GHz USB 3 V 3.6 V - 20 C + 70 C 15 mm x 13 mm x 2 mm Reel, Cut Tape
Quectel Modules multiprotocoles Wi-Fi 6 (2.4GHz/5GHz), ?IEEE 802.11a/b/g/n/ac/ax, BLE 5.4, Thread 802.15.4, Antenna 1 1 (1T1R), 2 antennas, Wi-Fi application: SDIO 3.0, -40C +85C
9011-09-26 attendu
Min. : 1
Mult. : 1
: 500
2.4 GHz, 5 GHz SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C PCB Antenna 23 mm x 14 mm x 2.2 mm BLE 5.4 802.11 a/b/g/n/ac/ax Reel, Cut Tape
Quectel Modules multiprotocoles NXP platform, SDIO Interface
10020-08-26 attendu
Min. : 1
Mult. : 1
: 1.000
2.4 GHz, 5 GHz SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C 12 mm x 12 mm x 2 mm BLE 5.4 802.11 a/b/g/n/ac/ax Reel, Cut Tape
Quectel Modules multiprotocoles Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM, 8MB Flash, Antenna: PCB, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm
10028-08-26 attendu
Min. : 1
Mult. : 1
: 500
2.4 GHz, 5 GHz GPIO, I2C, JTAG, SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C PCB Antenna 25.5 mm x 18 mm x 3.16 mm Reel, Cut Tape