Laird Technologies Tflex™ HD80000 Thermal Gap Filler
Laird Technologies Tflex™ HD80000 Thermal Gap Filler is a high-deflection series gap filler that combines 6W/mK thermal conductivity with superior pressure vs. deflection characteristics. This combination of features allows minimal stress on components while yielding low thermal resistance. Laird Technologies Tflex HD80000 material is extremely soft but also can be handled and applied manually without the need to add fiberglass or other reinforcement layers, maintaining the superior thermal performance of the product.
Features
- 6W/mK thermal conductivity
- Low pressure vs. deflection
- Excellent surface wetting for low contact resistance
- No fiberglass reinforcement
- Minimizes board and component stress
- Environmentally friendly solution that meets regulatory requirements, including RoHS and REACH
Specifications
- ±10% thickness tolerance
- 1mm to 5.0mm thickness range
- 3.3g/cc density
- -40°C to +150°C operating temperature range
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Published: 2019-03-27
| Updated: 2025-06-19