Renesas / Dialog AT25SF161B 16Mbit SPI Serial Flash Memory
Renesas / Dialog AT25SF161B 4Mbit SPI Serial Flash Memory is part of the Renesas standard class code and data storage solutions. The solution design is developed for 3V systems in which program code is followed from Flash memory into embedded or external RAM for execution.The Renesas / Dialog AT25SF161B is a serial interface Flash memory device created for various high-volume consumer-based applications. The flexible erase architecture of the AT25SF161B is also excellent for data storage, eliminating the requirement for additional data storage devices.
Features
- Universally compatible pinout and command set
- Standard block architecture
- Supports Dual I/O, Quad I/O, and XiP operation
- Continuous read, wrap, and burst modes for XiP
Specifications
- Serial Peripheral Interface (SPI) compatible
- Supports SPI modes 0 and 3
- Supports single input/output operations (1,1,1)
- Supports dual input and dual output operations (1-1-2), (1-2-2), (0-2-2)
- Supports quad input and quad output operations (1-1-4), (1-4-4), (0-4-4)
- Continuous Read mode (with 8/16/32/64 bytes wrap) - optimized for XiP
- 16Mbit Flash memory
- 108MHz maximum operating frequency
- Supply voltage options
- 2.7V to 3.6V
- 2.5V to 3.6V
- Serial Flash Discoverable Parameters (SFDP, JESD216B) support
- OTP memory
- 3x protected programmable security register pages (page size: 256 bytes)
- 64-bit factory programmable UID register
- Hardware Write Protection (WP pin)
- Software write protection (Programmable non-volatile control registers)
- Program and erase, suspend, and resume
- Byte programming size up to 256 bytes
- Erase size and duration
- Uniform 4kbyte block erase (50ms typical)
- Uniform 32kbyte block erase (120ms typical)
- Uniform 64kbyte block erase (200ms typical)
- Full chip erase (5.5 seconds typical)
- Low power dissipation
- 15µA maximum standby current
- 1.5µA maximum deep-power-down current
- Endurance of 100,000 program and erase cycles
- Data retention of 20 years
- Industrial -40°C to +85°C temperature range
- Industry-standard green (Pb/Halide-free/RoHS compliant) package options
- 8-lead SOIC (0.150" narrow and 0.208" wide)
- 8-pad ultra-thin DFN (5mm x 6mm x 0.6mm)
- 8-ball WLCSP (3mm x 2mm x 3mm grid array)
- Die wafer form
Block Diagram
Published: 2023-10-04
| Updated: 2023-11-07
