ROHM Semiconductor BST740D08P4A1x4 TRCDRIVE pack™ with Molded Modules
ROHM Semiconductor BST740D08P4A154 and BST740D08P4A164 TRCDRIVE pack™ with 2-in-1 SiC Molded Modules feature 750V rated voltage and are designed to significantly reduce the size of electric vehicle (xEV) inverters. These power-dense modules integrate 4th Generation SiC MOSFETs in a compact package with dimensions of 58.6mm x 52.5mm. The TRCDRIVE pack devices support up to 300kW and utilize a unique terminal configuration that addresses the key challenges of traction inverters regarding miniaturization, higher efficiency, and fewer person-hours. ROHM Semiconductor BST740D08P4A154 and BST740D08P4A164 modules provide ease of use for designers and do not require soldering for the signal terminals.Features
- Combination of press-fit pins and molding technology results in smaller design
- High power density due to higher heat dissipation and lower stray inductance
- Ease of use, including no soldering for signal terminals
- Discrete packaging production system for high productivity
- Designed for automotive traction inverters
- AQG 324 qualified
Specifications
- 750VDSS maximum voltage
- 738A maximum DC current
- Maximum AC current
- BST740D08P4A154: 634A
- BST740D08P4A164: 659A
- 1.4mΩ maximum RDS(on)
- Heat sink assembly
- BST740D08P4A154: TIM: heat dissipation sheet
- BST740D08P4A164: Ag sinter
- 58.6mm × 52.5mm dimensions
TRCDRIVE pack
Power-Dense Design
Published: 2024-06-13
| Updated: 2024-06-19
