Texas Instruments TMS320C6452 Digital Signal Processor (DSP)

Texas Instruments TMS320C6452 Digital Signal Processor (DSP) is a high-performance fixed-point DSP generation in the TMS320C6000™ DSP platform. The C6452 device is based on the architecture of third-generation, high-performance, and advanced VelociTI™ Very-Long-Instruction-Word (VLIW). This device performs up to 7200 Million Instructions Per Second (MIPS) at a 900MHz clock rate. The TMS320C6452 DSP features a 3-Port Gigabit Ethernet switch subsystem, two Telecom Serial Interface Ports (TSIP0/1), and one UART (with RTS and CTS Flow Control). This device is ideal for medical diagnostics, machine vision/inspection, radar and sonar, military/aerospace, and communications.

Features

  • High-performance digital media processor:
    • 720MHz, 900MHz C64x+™ clock rates
    • 1.39ns (-720) and 1.11ns (-900) instruction cycle time
    • 5760, 7200 MIPS
    • Eight 32-bit C64x+ instructions/cycle
    • Fully software-compatible with C64x/debug
    • Commercial temperature ranges (-720 and -900 only)
    • Industrial temperature ranges (-720 and -900 only)
  • VelociTI.2™ Extensions to VelociTI™ Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core:
    • Eight highly independent functional units with VelociTI.2 extensions:
      • Six ALUs (32-/40-bit), each supports single 32-bit, dual 16-bit, or quad 8-bit arithmetic per clock cycle
      • Two multipliers support four 16 x 16-bit multiplies (32-bit results) per clock cycle or eight 8 x 8-bit multiplies (16-bit results) per clock cycle
    • Load-store architecture with non-aligned support
    • 64 32-bit general-purpose registers
    • Instruction packing reduces code size
    • All instructions conditional
    • Additional C64x+™ enhancements:
      • Protected mode operation
      • Exceptions support error detection and program redirection
      • Hardware support for modulo loop Auto-Focus module operation
  • C64x+ instruction set features:
    • Byte-addressable (8-/16-/32-/64-bit data)
    • 8-bit overflow protection
    • Bit-field extract, set, and clear
    • Normalization, saturation, and bit-counting
    • VelociTI.2 increased orthogonality
    • C64x+ extensions:
      • Compact 16-bit instructions
      • Additional instructions to support complex multiplies
  • C64x+ L1/L2 memory architecture:
    • 256K-bit (32K-byte) L1P program RAM/Cache (direct mapped)
    • 256K-bit (32K-byte) L1D data RAM/Cache (2-way set-associative)
    • 1408KB L2 unified mapped RAM/Cache (flexible allocation)
  • Supports Little Endian mode only
  • External Memory Interfaces (EMIFs):
    • 32-bit DDR2 SDRAM memory controller with 512M-byte address space (1.8V I/O)
    • Asynchronous 16-bit wide EMIF (EMIFA):
      • Up to 128M-byte total address reach
      • 64M-byte address reach per CE space
    • Glueless interface to asynchronous memories (SRAM, Flash, and EEPROM)
    • Synchronous memories (SBSRAM and ZBT SRAM)
    • Supports interface to standard sync devices and custom logic (FPGA, CPLD, ASICs, etc.)
  • Enhanced Direct-Memory-Access (EDMA) controller (64 independent channels)
  • 3-Port Gigabit Ethernet switch subsystem
  • Four 64-bit general-purpose timers (each configurable as two 32-bit timers)
  • One UART (with RTS and CTS flow control)
  • One 4-wire Serial Port Interface (SPI) with two chip-selects
  • Master/Slave inter-integrated circuit (I2C Bus™)
  • Two Telecom Serial Interface Ports (TSIP0/1)
  • Multichannel Audio Serial Port (McASP):
    • Ten Serializers and SPDIF (DIT) mode
  • 16/32-bit Host-Port Interface (HPI)
  • Advanced Event Triggering (AET) compatible
  • 32-bit 33-/66MHz, 3.3V Peripheral Component Interconnect (PCI) Master/Slave interface conforms to PCI specification 2.3
  • VLYNQ™ interface (FPGA interface)
  • On-chip ROM bootloader
  • Individual power-saving modes
  • Flexible PLL clock generators
  • IEEE-1149.1 (JTAG™) Boundary-Scan-Compatible
  • 32 General Purpose I/O (GPIO) pins (multiplexed with other device functions)
  • Package:
    • 529-pin nFBGA (ZUT suffix)
    • 19mm x 19mm, 0.8mm pitch BGA
    • 0.09µm/6-Level Cu Metal Process (CMOS)
  • 3.3V and 1.8V I/O, 1.2V internal (-720 and -900)

Applications

  • Medical diagnostics
  • Machine vision/inspection
  • Radar and sonar
  • Military/aerospace
  • Communications

Functional Block Diagram

Block Diagram - Texas Instruments TMS320C6452 Digital Signal Processor (DSP)
Published: 2024-05-02 | Updated: 2024-06-16