TGP 12000ULM 12W/m-K, Extremely Soft GAP PAD®

Bergquist Company TGP 12000ULM 12W/m-K, Extremely Soft GAP PAD^® is formulated to address the demands of high power density designs found in hyper-scale and cloud-scale data centers. Bergquist TGP 12000ULM features high thermal conductivity and ultra-low modulus thermal interface material (TIM). These design features make the TGP 12000ULM ideal for modern datacom applications. Among the highest-performing TIMs available on the market, TGP 12000ULM combines high thermal conductivity of 12.0W/m-K with soft, conforming properties to ensure excellent wet out at the interface for optimized thermal transfer and low assembly stress. TGP 12000ULM is built on a silicone-based resin platform with unique filler technology to accommodate excellent heat dissipation while simultaneously reducing stress on small-footprint, miniaturized components.