+ 85 C Multiprotokoll-Module

Ergebnisse: 616
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Beschreibung Datenblatt Verfügbarkeit Preis (EUR) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern.
Menge RoHS ECAD Model Serie
Frequenz
Ausgangsleistung
Schnittstellen-Typ
Versorgungsspannung - Min.
Versorgungsspannung - Max.
Minimale Betriebstemperatur
Maximale Betriebstemperatur
Antennenanschlusstyp
Abmessungen
Protokoll – Bluetooth, BLE – 802.15.1
Protokoll – Mobilfunk, NBIoT, LTE
Protokoll – GPS, GLONASS
Protokoll – Sub-GHz
Protokoll – WLAN – 802.11
Protokoll – ANT, Thread, Zigbee – 802.15.4
Qualifikation
Verpackung
Kaga FEI Multiprotokoll-Module WiFi 11ac/a/b/g/n, Bluetooth V4.2. Size 24.0 x 11.5 x2.0mm module with RF connector. Nicht auf Lager
Min.: 960
Mult.: 960

14 dBm 3 V 3.6 V - 30 C + 85 C 24 mm x 11.5 mm x 2 mm 802.11 a/b/g/n/ac
Inventek Multiprotokoll-Module 802.11a/b/g/n serial-to-WiFi and BT 4.0 combo module with integrated TCP/IP stack. 2.4 and 5 GHz Chip Antenna. Inventek AT Commands (IWIN) firmware and Cypress WICED compatible. Certified FCC/CIC/CE
Datenblatt

ISM43340 2.4 GHz, 5 GHz 19 dBm SPI, UART 3.3 V 3.3 V - 40 C + 85 C Chip 14.5 mm x 34 mm x 2.5 mm Bluetooth 802.11 a/b/g/n Tray
Inventek Multiprotokoll-Module 802.11a/b/g/n serial-to-WiFi and BT 4.0 combo module with integrated TCP/IP stack. U.FL for External Antenna. Inventek AT Commands (IWIN) firmware and Cypress WICED compatible. Certified FCC/IC/CE
Datenblatt

ISM43340 2.4 GHz, 5 GHz 19 dBm SPI, UART 3.3 V 3.3 V - 40 C + 85 C u.FL 14.5 mm x 34 mm x 2.5 mm Bluetooth 802.11 a/b/g/n Tray
Inventek Multiprotokoll-Module
Datenblatt
Nicht auf Lager
Min.: 2.000
Mult.: 2.000
: 2.000

2.4 GHz 17 dBm I2S, SPI, UART 2 V 3.6 V - 40 C + 85 C u.FL 10 mm x 10 mm BLE, Bluetooth 5.1 802.11 b/g/n Reel
Inventek Multiprotokoll-Module 802.11 b/g/n WiFi and BT 4.2 combo and STM32F412 WICED Module with Chip Antenna. Certified FCC/IC/CE
Datenblatt
Nicht auf Lager
Min.: 980
Mult.: 196

2.4 GHz 17 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C Chip 14.5 mm x 34 mm BLE, Bluetooth 4.2 802.11 b/g/n Tray
Espressif Systems Multiprotokoll-Module Built-in ESP32-S31 series chip. featuring a RISC-V 32-bit dual-core microprocessor. Main pin compatible with ESP32-S3-WROOM-1. Suitable for embedded systems, smart home, wearable electronic devices, and other loT scenarios.
Datenblatt
Nicht auf Lager
Min.: 3.250
Mult.: 3.250

320 MHz GPIO, SPI, USB 3 V 3.6 V - 40 C + 85 C Bluetooth 5.4 IEEE 802.11ax
Espressif Systems Multiprotokoll-Module ESP32-WROVER-IE integrates ESP32-D0WD-V3, with higher stability and safety performance
Datenblatt
Nicht auf Lager
Min.: 3.250
Mult.: 650

ESP32-WROVER-IE 2.4 GHz 20 dBm I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C IPEX 18 mm x 31.4 mm x 3.3 mm BLE, Bluetooth 4.2 BR/EDR 802.11 b/g/n
Insight SiP Multiprotokoll-Module ISP3010-UX nRF52832 BLE 5 Module
Datenblatt
Nicht auf Lager
Min.: 250
Mult.: 250
: 250
2.4 GHz to 2.8 GHz SPI 1.8 V 6 V - 40 C + 85 C 14 mm x 14 mm x 1.5 mm BLE Reel
Insight SiP Multiprotokoll-Module ISP3010-UX nRF52832 BLE 5 Module
Datenblatt
Nicht auf Lager
Min.: 500
Mult.: 500
: 500
2.4 GHz to 2.8 GHz SPI 1.8 V 6 V - 40 C + 85 C 14 mm x 14 mm x 1.5 mm BLE Reel
Insight SiP Multiprotokoll-Module ISP3010-UX nRF52832 BLE 5 Module
Datenblatt
Nicht auf Lager
Min.: 50
Mult.: 50
2.4 GHz 4 dBm SPI 1.8 V 6 V - 30 C + 85 C Built-In 14 mm x 14 mm x 1.5 mm Bluetooth 5.0 Tray
Insight SiP Multiprotokoll-Module nRF52832 LoRa Transceiver & BLE 5 Module AS
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 36 Wochen
Min.: 500
Mult.: 500
: 500
1.8 V 3.6 V - 30 C + 85 C Reel
Insight SiP Multiprotokoll-Module nRF52832 LoRa Transceiver & BLE 5 Module EU
Datenblatt
Nicht auf Lager
Min.: 250
Mult.: 250
: 250
1.8 V 3.6 V - 30 C + 85 C Reel
Insight SiP Multiprotokoll-Module nRF52832 LoRa Transceiver & BLE 5 Module EU
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 36 Wochen
Min.: 500
Mult.: 500
: 500
ISP4520 1.8 V 3.6 V - 30 C + 85 C Reel
Insight SiP Multiprotokoll-Module nRF52832 LoRa Transceiver & BLE 5 Module US
Datenblatt
Nicht auf Lager
Min.: 250
Mult.: 250
: 250
902 MHz to 928 MHz, 2.4 GHz 22 dBm SPI 1.8 V 3.6 V - 30 C + 85 C External 9.8 mm x 17.2 mm x 1.7 mm Bluetooth 5.0 Reel
Insight SiP Multiprotokoll-Module nRF52832 LoRa Transceiver & BLE 5 Module US
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 36 Wochen
Min.: 500
Mult.: 500
: 500
1.8 V 3.6 V - 30 C + 85 C Reel
GigaDevice Multiprotokoll-Module RISC-V with BLE 5.2 and WiFi 6 certified module / 9.5 x 12.4 / 21 GPIO / -40-85 degC / external IPEX connection
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 25 Wochen
Min.: 1
Mult.: 1

RISC-V 2.412 GHz to 2.484 GHz 23.4 dBm UART 3 V 3.6 V - 40 C + 85 C 12.4 mm x 9.6 mm x 2.4 mm BLE WiFi
GigaDevice Multiprotokoll-Module RISC-V with BLE 5.2 and WiFi 6 certified module / 15 x 12.4 / 21 GPIO / -40-85 degC / onboard PCB antenna
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 25 Wochen
Min.: 1
Mult.: 1

RISC-V 2.412 GHz to 2.484 GHz 23.4 dBm UART 3 V 3.6 V - 40 C + 85 C 15 mm x 12.4 mm x 2.4 mm BLE WiFi
u-blox Multiprotokoll-Module 88W8887, 802.11ac+BT, 1 antenna pin, LTE filter
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 18 Wochen
Min.: 500
Mult.: 500
: 500

2.4 GHz, 5 GHz 18 dBm GPIO, SDIO, UART 2.97 V 3.63 V - 40 C + 85 C 19.8 mm x 13.8 mm x 2.5 mm Bluetooth 802.11 a/b/g/n/ac Reel
u-blox Multiprotokoll-Module 88W8887, 802.11ac+BT, 2 antenna pins
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 18 Wochen
Min.: 500
Mult.: 500
: 500

2.4 GHz, 5 GHz 18 dBm GPIO, SDIO, UART 2.97 V 3.63 V - 40 C + 85 C 19.8 mm x 13.8 mm x 2.5 mm Bluetooth 802.11 a/b/g/n/ac Reel
u-blox Multiprotokoll-Module M.2 card with JODY-W377, in tray, SDIO interface
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 18 Wochen
Min.: 1
Mult.: 1

2.5 GHz, 5 GHz 16 dBm, 19 dBm I2S, UART 3.135 V 3.465 V - 40 C + 85 C u.FL 30 mm x 22 mm x 3.21 mm 802.11 a/b/g/n Tray
u-blox Multiprotokoll-Module M.2 Type 2230 Key E card with MAYA-W472 Wi-Fi 6 Dual-Band, Bluetooth 5.4, 802.15.4 module Nicht-auf-Lager-Vorlaufzeit 20 Wochen
Min.: 140
Mult.: 140

MAYA-W4 2.405 GHz to 2.48 GHz 2 dB SPI, UART 1.71 V 3.46 V - 40 C + 85 C 14.3 mm x 10.4 mm x 2 mm Bluetooth WiFi Tray
u-blox Multiprotokoll-Module Wi-Fi 6 Dual-Band, BLE 5.4, 802.15.4, host-based module, 2 ant pins
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 20 Wochen
Min.: 1
Mult.: 1
: 500

MAYA-W4 2 dB SPI, UART 1.71 V 3.46 V - 40 C + 85 C 14.3 mm x 10.4 mm x 2 mm Bluetooth WiFi Reel, Cut Tape
u-blox Multiprotokoll-Module Wi-Fi 6 Dual-Band, BLE 5.4, 802.15.4, host-based module, U.FL conn, NXP610
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 20 Wochen
Min.: 500
Mult.: 500
: 500

MAYA-W4 2 dB SPI, UART 1.71 V 3.46 V - 40 C + 85 C 14.3 mm x 10.4 mm x 2 mm Bluetooth WiFi Reel
u-blox Multiprotokoll-Module Wi-Fi 6 Dual-Band, BLE 5.4, 802.15.4, host-based module, embedded antenna Nicht-auf-Lager-Vorlaufzeit 20 Wochen
Min.: 500
Mult.: 500
: 500

MAYA-W4 2.402 GHz to 2.48 GHz 2 dB SPI, UART 1.71 V 3.46 V - 40 C + 85 C 14.3 mm x 10.4 mm x 2 mm Bluetooth WiFi Reel
u-blox Multiprotokoll-Module Secure industrial Wi-Fi and Bluetooth u-connectXpress software and internal antenna
Datenblatt
Nicht auf Lager
Min.: 500
Mult.: 500
: 500

NINA-W15 2.4 GHz 8 dBm, 18 dBm GPIO, I2C, I2S, SPI, UART 3.3 V 3.3 V - 40 C + 85 C PCB 10 mm x 14 mm x 2.2 mm Bluetooth, BLE 802.11 b/g/n Reel