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Chip Quik DFN-6 to DIP-6/10 SMT Adapters are built on FR-4 material and include surface-mount male vertical headers, wire wrap, or machine pins. These adapters are designed with a top-side footprint for surface-mount components, while the bottom side includes pads for two single-row surface-mount vertical headers. The SMT adapters offer a UL 94V-0 flammability rating and comply with IPC-A-610 Class II standards. These adapters operate from -40°C to +130°C temperature range and withstand a maximum reflow temperature of +260°C. The SMT adapters are lead-free and are RoHS compliant. These adapters feature a PCB size of 25.4mm x 7.62mm x 1.6mm (IPC0272) and 25.4mm x 12.7mm x 1.6mm (IPC0273).
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Chip Quik DFN-6 to DIP-6/10 SMT AdaptersConstructed using FR-4 material and offer a UL 94V-0 flammability rating.03-08-26
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Chip Quik Extra-Narrow SMT-to-DIP AdaptersDesigned to replace obsolete DIP ICs with newer surface-mount components.29-07-26 -
NXP Semiconductors KITPF09FRDMPGM ProgrammierboardEntwicklungs-Sockelplatine mit dem PF09 9-Kanal-Leistungsmanagement-IC (PMIC).10-04-26 -
Grinn AstraADA-1680 Core Module AdapterIntegrates the AstraSOM‑1680 with the Synaptics Astra Machina Foundation Series demo board.07-04-26 -
Renesas Electronics ForgeFPGA™ Steckkarten-Development-KitsErmöglichen eine Verbindung zwischen den Pins eines ForgeFPGA™ und des Development Boards Go Configure.19-01-26 -
Trenz Electronic CR00240-01-A CRUVI HDMI AdapterIncludes a high-speed level shifter and is based on active DDC Puffer PTN3363BSMP.13-11-25 -
FRAMOS FPA-4.A/AGX-Kit Processor Adapter KitConnects FSM:GO and the FSM Ecosystem to the NVIDIA Jetson AGX family.30-01-25 -
FRAMOS FPA-A/P22-Kit Processor Adapter KitConnects FSM:GO and the FSM Ecosystem to the NVIDIA Jetson Orin Nano/NX Devices and Raspberry Pi 5.30-01-25 -
FRAMOS FPA-A/NDK-Kit Processor Adapter KitConnects FSM:GO and the FSM Ecosystem to the NXP i.MX8M Plus Developer Kit.30-01-25 -
FRAMOS FSM:FSA Embedded Image Sensor EcosystemEvaluation and customization with dual-board sensor modules.29-01-25 -
FRAMOS FPA-A/P24-Kit Processor Adapter KitConnects FSM:GO and the FSM Ecosystem to the Toradex Verdin, Mallow, and Dahlia carrier boards.28-01-25 -
Renesas Electronics GreenPAK™ SLG4752x Mischsignal-MatrixFür Mischsignal-Funktionen mit hohem Wirkungsgrad in verschiedenen Applikationen ausgelegt.21-10-24 -
Microchip Technology EV88N31A AdapterplatineZur Evaluierung des MPPB-Adapters AVR16EB32-CNANO ausgelegt.23-07-24 -
Chip Quik Socket to DIP AdaptersAvailable in MSOP to DIP, QFN to DIP, and SOIC to DIP configurations.31-05-24 -
Chip Quik DIP600 SOIC AdaptersFeature-wide and narrow-bodied adapters are available in 8 to 28 Dual In-Line Package (DIP) range.14-05-24 -
Microchip Technology AC69T88A 5-Zoll LVDS WVGA LCD-Display-Modul-KitVerbessert MPU-Curiosity-Boards mit einem kapazitiven Berührungssensor.05-11-23 -
ProGrAnalog X-Pod for Xilinx Power Test AdaptorForm Factor Equivalent Device (FFED) for testing AMD Xilinx Versal ACAP VC1902-VSVA2197 FPGAs.09-10-23 -
ProGrAnalog FFED-VC1902-VSVA2197 AMD Xilinx Power Test AdaptorOffers rapid testing to validate power delivery solutions.09-10-23 -
ProGrAnalog LSP-Kit-OracADJ-X Kit for XilinxPowered through a 24V barrel jack and connected via a Mini-B USB.05-10-23 -
Chip Quik Dual Row AdaptersInclude DIP-08 Adapters to dual row 0.35mm pitch stencils to compact series adapters.16-08-23 -
ProGrAnalog Xilinx-LeistungsprüfadapterMit einer GUI ausgelegt, die Transienten, Impulszug, Impedanz und 3D-Diagramme unterstützt.20-03-23 -
TE Connectivity LGA 4677 SockelFür hohe Bandbreitenanforderungen ausgelegt und mit PCIe- (Generation 5) und DDR5-8-Kanal-Unterstützung verfügbar.10-01-23 -
Renesas Electronics SLG47115V-SKT SockelboardErmöglicht es Benutzern, das Konfigurieren des SLG47115V HVPAK™ Geräts mithilfe des SLG4DVKADV Development Boards.15-09-22