New Thermal Interface Products
StarTech High-Performance Silicone Thermal Paste is designed for efficient heat transfer and safe application in various environments. This paste is a silicone-based thermal compound with a thermal conductivity of 14.5W/m-K and a wide operating temperature range of -50°C to +280°C, maintaining thermal stability in CPUs, GPUs, and ICs with high TDP under continuous load. A resealable 10g syringe with screw cap and plunger is included with this paste from Startech, enabling controlled, repeatable use in upgrades, repairs, or custom builds. By utilizing electrically non-conductive grease, damaging shorts are prevented, supporting safe use in space-constrained or critical system builds.
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StarTech High-Performance Silicone Thermal PasteDesigned for efficient heat transfer and safe application in various environments.08-04-26
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Bourns BTJ Thermal Jumper ChipsUnique surface-mount components that provide high thermal conductivity for thermal dissipation.02-02-26 -
Advanced Thermal Solutions Thermal Transfer Plates for NVIDIA® Jetson™Designed for targeted heat management for NVIDIA® Jetson™ modules lacking integrated thermal plates.06-11-25 -
Laird Technologies Tflex™ HR6.5 Thermal Gap FillerThermal interface material with >6W/mK thermal conductivity with high recovery properties.15-09-25 -
Laird Technologies Tflex™ CR350S 2-Part Dispensable Gap FillersProvide high thermal conductivity, low thermal resistance, and high reliability.09-09-25 -
Laird Technologies Tputty™ SF560 1-Part Dispensable Gap FillersDesigned to offer thermal conductivity of 5.6W/mK, along with superior thermal resistance.25-08-25 -
Wakefield Thermal ulTIMiFlux Dielectric Phase Change TIMThermally conductive electrical insulators for semiconductor-to-heat sink interfaces23-07-25 -
Laird Technologies Tflex™ CR550 2-Part Dispensable Gap FillerTransfers unwanted heat in automotive components and the A+B putty material cures in place.25-10-24 -
Laird Technologies Tflex SF4 Thermal Gap FillersSilicon-free and offers a 0.5mm to 4mm thickness range with 4.0W/mK thermal conductivity.10-09-24 -
Laird Technologies Tflex SF7 Thermal Gap FillersInnovative, high-performing thermal material with silicone-free construction.10-09-24 -
Bergquist Company TGF 2900LVO 2.9W/m-K Limited Outgassing Gap FillerSilicone, two-part room-temperature curable gap filler ideal for electronic assembly applications.30-05-24 -
Bergquist Company TGP 40000SF 40W/m-K Silicone Free GAP PAD®Features gap-filling materials that achieve an ultra-high 40W/m-K thermal conductivity.27-05-24 -
Stackpole Electronics TMJ Surface Mount Thermal Jumper Chip ResistorsFeatures chip sizes ranging from 0603 to 2512.18-01-24 -
MG Chemicals Non-Silicone Liquid Thermal Gel1-part gel that offers extreme thermal conductivity and flame retardancy.30-10-23 -
LeaderTech TCF Ultra-Thin Carbon Fibre Thermal PadsLow thermal resistance, soft surface, and mainly uses carbon fibre as a thermally conductive filler.18-10-23 -
LeaderTech TGN Ultra-Thin Thermal PadsFeatures low thermal resistance and is manufactured by combining graphene and silicone.18-10-23 -
LeaderTech TCI Composite Indium SheetTransitions from solid to liquid at its melting point and back to solid again at room temperature.18-10-23 -
Wakefield Thermal 127-12 Extreme Performance Sil-Free Thermal GreaseFeature extreme performance, phase change, and non-silicone with 12W/m-K thermal conductivity.27-09-23 -
Laird Technologies CoolZorb 200 Hybrid TIM/EMI AbsorbersHybrid absorber/thermal management materials used for EMI mitigation and heat dissipation.08-09-23 -
Bergquist Company Data Centre ApplicationsAdvanced materials help with thermal management, long-term reliability, and stress protection.01-04-23 -
Laird Technologies Tpcm™ 7000 High-Performance TIMsDesigned to enhance the cooling of the thermal challenges in electronics.03-08-22 -
Laird Technologies Tflex™ HD7.5 Thermal Gap FillerSoft silicone material that offers high deflection and 7.5W/mK thermal conductivity.03-08-22 -
Laird Technologies Tpcm™ 5000 High-Performance TIMFeatures low thermal resistance and a non-silicone formulation with a naturally tacky surface.19-07-22 -
Bergquist Company Liqui-Form TLF 10000 10W/m-K Thermal GelAssures high thermal conductivity, good dispensing efficiency, and high thermal reliability.11-07-22 -
Laird Technologies Ttape™ 1000A Thermally Conductive TapePressure-sensitive adhesive with low thermal resistance, only needs finger pressure for application.03-06-22